WEO AI-Critical Materials Register
This register defines the materials that qualify under the TRACE pathway (Manual §3.5, Option G, Condition 1) without requiring individual causal-chain documentation each time. Materials on this register have pre-established AI infrastructure relevance at primary source standard. Materials not on this register may still qualify through individual Condition 1(a)+(b) documentation.
| Material | AI Infrastructure Application | Primary Source |
|---|---|---|
| Gallium | GaN power semiconductors; GaAs compound semiconductors for RF/mmWave in DC networking | USGS Mineral Commodity Summaries; EU CRMA Annex I |
| Germanium | Fibre optic signal amplification (GeO₂ dopant); infrared optics; SiGe heterojunction transistors | USGS MCS; BGS Critical Minerals Strategy |
| Rare Earth Elements (NdPr) | NdFeB permanent magnets: HDD voice-coil actuators, server cooling fan motors, power conversion | USGS MCS; Shin-Etsu Chemical technical documentation |
| Cobalt | Li-ion battery cathodes for data centre UPS and grid-scale storage | IEA Global EV Outlook (battery chemistry data); USGS MCS |
| Lithium | Li-ion battery cells for data centre UPS, grid-scale energy storage | IEA; USGS MCS |
| Graphite | Li-ion battery anode material (natural and synthetic) | USGS MCS; EU CRMA Annex I |
| Antimony | Flame retardant in data centre cabling and PCB substrates (Sb₂O₃); lead-acid battery hardening | USGS MCS |
| Silicon metal (high-purity) | Polysilicon feedstock for semiconductor-grade wafer production | SEMI; USGS MCS |
| Palladium | MLCC electrodes in AI accelerator PCBs; wire bonding in semiconductor packaging | Johnson Matthey PGM Market Report |
| Tantalum | Capacitors in server power delivery; ALD precursors in advanced fab processes | USGS MCS; TechInsights teardown data |
| Neon | Excimer laser gas for DUV lithography | Techcet Critical Materials Report |
| Fluorine compounds (high-purity) | Etch gases (CF₄, C₄F₈, NF₃, SF₆) in semiconductor fabrication | Techcet; Linde technical documentation |
The AI-Critical Materials Register is reviewed at methodology version milestones. Materials are added when their AI infrastructure application is documented at primary source standard. Materials are removed when the AI infrastructure application is superseded (e.g., a material replaced by a substitute in semiconductor manufacturing). The register is a convenience list, not an exhaustive boundary — materials not on the register can qualify through individual Condition 1(a)+(b) documentation.